AMD 16-core Ryzen a Multi-Chip Module of two "Summit Ridge" Dies

With core performance back to competitiveness, AMD is preparing to take on Intel in the HEDT "high-end desktop" segment with a new line of processors that are larger than its current socket AM4 "Summit Ridge," desktop processors, but smaller in core-count than its 32-core "Naples" enterprise processors. These could include 12-core and 16-core parts, and the picture is getting clearer with an exclusive report by Turkish tech publication DonanimHaber. The biggest revelation here that the 12-core and 16-core Ryzen processors will be multi-chip modules (MCMs) of two "Summit Ridge" dies. The 12-core variant will be carved out by disabling 1 core per CCX (3+3+3+3).

Another revelation is that the 12-core and 16-core Ryzen processors will be built in a new LGA package with pin-counts in excess of 4,000 pins. Since it's an MCM of two "Summit Ridge" dies, the memory bus width and PCIe lanes will be doubled. The chip will feature a quad-channel DDR4 memory interface, and will have a total of 58 PCI-Express gen 3.0 lanes (only one of the two dies will put out the PCI-Express 3.0 x4 A-Link chipset bus). The increase in core count isn't coming with a decrease in clock speeds. The 12-core variant will hence likely have its TDP rated at 140W, and the 16-core variant at 180W. AMD is expected to unveil these chips at the 2017 Computex expo in Taipei, this June, with product launches following shortly after.